SLE Services for Quantum Technologies

SLE

Realize your idea of ion trap, chip carrier and beyond.

  • Dimensions: maximum 5x200x200 mm
  • Materials: Currently Fused silica; borofloat glass and Saphire later
  • Precision: Min structure size and precision depending on required etch times
  • Coating: Various metals, PVD sputter coating
  • Assembly : high precision die bonder, sub um accuracy, glue, solder and fusion bonding
  • Status: available
  • Price: contact sales
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